• Chetan Arvind Patil
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  • NLOG-261 | Semiconductor And Beyond Newsletter | The Semiconductor Thermal Issues

NLOG-261 | Semiconductor And Beyond Newsletter | The Semiconductor Thermal Issues

Thermal issues in semiconductors are often underestimated until they manifest in failures.

From design to final test, temperature affects leakage, delay, aging, and performance.

As power density increases and 3D integration becomes common, controlling junction temperature (Tj) is no longer optional. It is an engineering and business necessity.

Let us break down the thermal problem technically and practically.

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