The Semiconductor Die Interconnects

Semiconductor die interconnects enable communication between different components within a package, playing a key role in chiplet-based architectures, 3D stacking, and advanced packaging.

As semiconductor designs push for higher performance and lower power consumption, interconnect technologies must evolve to address signal integrity, thermal management, and manufacturing complexity while ensuring efficient high-speed communication.

This edition explores die interconnect types, recent advancements like hybrid bonding and TSVs, and the challenges of interconnect scaling, including manufacturing precision, thermal dissipation, and standardization barriers.

Including examining industry trends, such as universal die-to-die interconnect standards, AI-driven process control, and the future of heterogeneous integration, shaping the next generation of semiconductor packaging.