Semiconductor scaling is moving beyond traditional transistor shrinking. As AI and high-performance computing demand more processing capability, memory bandwidth, and efficient communication, advanced packaging is becoming essential to increasing computing performance.

For decades, scale-up focused on improving performance within a single silicon die. However, growing challenges related to die size, manufacturing yield, power consumption, and thermal management are changing this approach.

Advanced packaging is enabling a new era of scale-up. Technologies such as 2.5D integration, chiplets, silicon interposers, and 3D stacking allow multiple compute dies and high bandwidth memory (HBM) to operate within a tightly integrated package.

This transition also introduces new challenges. Power delivery, cooling, die-to-die communication, testing, manufacturing yield, and cost must all be managed as integration complexity increases.