The Semiconductor Is Running The World

The dominance of semiconductor giants like NVIDIA, with a market capitalization exceeding $3 trillion, and TSMC, valued at nearly $700 billion, among the top 10 largest companies globally, underscores the seismic shift towards a semiconductor-driven economy.

These (and many other) firms, pivotal in the semiconductor industry, highlight the sector's critical role in underpinning most of today's technological landscape. With semiconductors at the heart of an array of technologies - from artificial intelligence and data centers to consumer electronics and automotive systems - this industry's influence mirrors the transformative power of oil in the previous century. 

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THREAD

 1. Surat, Gujarat, renowned as the "Diamond City," processes about 90% of the world's rough diamonds, making it a global hub for diamond cutting and polishing. This industry has fostered a community with deep expertise in imports/exports and a robust understanding of business operations within India, alongside a skilled workforce accustomed to high-value tasks. These established businesses are now exploring diversification opportunities.

The connection between Surat's diamond industry and semiconductors lies in the emerging use of diamond as an alternative to silicon in semiconductor devices. Diamond offers superior heat management, power efficiency, and enables further miniaturization of electronic devices. It's seen as environmentally friendly due to its enhanced thermal performance and could be more cost-effective over time. Despite the potential, transitioning diamond processing techniques to semiconductor manufacturing faces significant challenges.

India, with its advanced diamond processing capabilities, is positioned to make a substantial impact on the semiconductor industry. By adapting its diamond expertise to semiconductor manufacturing, India could unlock new opportunities in power electronics and beyond. Although the transition presents hurdles, there are already solutions exploring the use of diamond processing techniques in semiconductors. Leveraging this unique position, India could significantly contribute to the semiconductor industry, potentially marking the beginning of a new era of innovation and collaboration.

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2. The concept of Quantum Lithography, introduced in a pivotal 2001 paper, aimed to overcome the miniaturization limitations faced by traditional semiconductor manufacturing techniques. This innovative approach, grounded in quantum mechanics, suggested the potential for significant advancements in the fabrication of smaller, more efficient semiconductor devices by leveraging principles of quantum entanglement and interference.

Despite the groundbreaking ideas presented, quantum lithography has not seen practical application or deployment in the two decades following the paper's publication. Interest in the field remained largely academic until a resurgence in attention emerged last year, marked by a significant research and development agreement between ASML and Eindhoven University of Technology. This partnership, focused on fields including photonics, quantum computing, nano materials, and chip manufacturing, indirectly hints at renewed interest in exploring quantum lithography, especially as it relates to advancements in quantum computing.

The potential applications of quantum lithography, especially in the realm of sub-1nm feature sizes, could revolutionize semiconductor manufacturing by enabling further miniaturization beyond the current physical and economic limitations of photolithography. The transition to using quantum entanglement in lithography could sidestep the escalating costs and technical challenges associated with moving to shorter-wavelength optical systems for smaller chip features.

Quantum lithography presents a promising yet challenging frontier in semiconductor technology, offering a potential solution to the physics and cost barriers of further miniaturization. The interest from major research and industry players signifies the beginning of a journey towards harnessing quantum mechanics not just for computing, but also for the foundational processes of semiconductor fabrication.

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3. The World Semiconductor Council (WSC) serves as an international forum aimed at fostering global cooperation within the semiconductor industry. Its existence points to a recognition of the need for collaborative efforts across borders to address common challenges and opportunities in the semiconductor sector. However, the extent to which the WSC is acknowledged as the definitive council for these purposes remains ambiguous.

The WSC boasts membership from major Semiconductor Industry Associations across the globe, including China, Taiwan, Europe, Japan, Korea, and the United States. This diverse membership underscores the council's potential to serve as a pivotal platform for international dialogue and action.

The council's agenda spans crucial issues such as environmental, safety, and health standards; protection of intellectual property; promotion of free and open markets; and overall market dynamics. These focus areas are critical for the sustainable and ethical growth of the semiconductor industry worldwide.

Given the strategic importance of semiconductors in global technology and economic landscapes, the significance of a body like the WSC is poised to escalate. This is particularly true as more countries strive to secure their positions within the global semiconductor value chain. Despite its potential, there's an observation that the WSC may not be as active or as influential as it could be in steering the industry towards more collaborative and less competitive dynamics.

This situation raises the question of whether it's time for the WSC to undergo a transformation. Such a revamp could involve expanding its focus areas, welcoming new members, and possibly reestablishing itself under a broader global framework. The aim would be to ensure that the semiconductor industry evolves into a more cooperative and competitive ("coopetition") environment, rather than one marked by fierce rivalry.

This call to action suggests a pivotal moment for the WSC and the global semiconductor industry at large. A reinvigorated council could play a crucial role in navigating the complex, rapidly changing technological and geopolitical landscapes affecting the semiconductor sector. The emphasis on cooperation could help mitigate risks, leverage synergies across different regions, and ensure a more stable and prosperous future for the industry worldwide.

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4. The journey of improving semiconductor yield, alongside learning and management during product development, intriguingly mirrors the cognitive phenomenon known as the Dunning-Kruger Effect. This psychological effect describes a cycle of overestimating one's competence in the early stages of learning, followed by a phase of recognizing one's limitations, and eventually acquiring a more accurate understanding of one's abilities and the task at hand.

In the context of semiconductor yield improvement, this cycle begins with an initial confidence where one feels well-equipped to tackle all yield-related issues. This optimism is often met with the harsh reality that solving yield problems is significantly more challenging than anticipated, leading to a period of realization and humility.

As one progresses through the phases of product development, particularly during the characterization phase, there emerges a turning point. It's here that the yield engineer starts to gain a firmer grasp on the complexities of the process, addressing and resolving issues systematically, which gradually moves the product closer to being production-worthy.

The culmination of this journey is not the end, but rather a segue into the next project. It's a perpetual cycle of learning, facing new challenges, and growing—one that mirrors the Dunning-Kruger Effect. Each project becomes a roller coaster ride of initial overconfidence, followed by the sobering reality of complexity, and eventually, a mature understanding and mastery of the task.

For yield engineers, this reflective question prompts introspection about their own experiences and learning curves in the semiconductor industry. It highlights the importance of humility, persistence, and continuous learning in the face of ever-evolving challenges within semiconductor yield improvement and product development.

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5. Das Sharma, D., Pasdast, G., Tiagaraj, S., and their team have contributed a significant piece to the evolving discourse on semiconductor technology with their article on chiplet design, titled "High-Performance, Power-Efficient Three-Dimensional System-In-Package Designs With Universal Chiplet Interconnect Express." This publication delves into the intricacies of creating system-in-package (SiP) designs that not only aim to match but potentially exceed the power, performance, and reliability characteristics of traditional monolithic system-on-chip (SoC) architectures, especially as the bump pitch narrows down to approximately 1µm.

The focus on achieving high performance and power efficiency in three-dimensional SiP designs through the use of universal chiplet interconnect express technology marks a notable advancement in semiconductor packaging techniques. This study is particularly relevant for those interested in the forefronts of advanced packaging, chiplet technology, 3D integration, and the critical die-to-die interfaces that enable these innovations.

The exploration of die-to-die interfaces is especially timely, as the semiconductor industry begins to more fully embrace chiplet-based architectures. This shift is driven by the need for more flexible, scalable, and cost-effective solutions compared to monolithic SoC designs. Chiplets allow for the combination of multiple discrete components into a single package, offering the potential for enhanced performance, reduced power consumption, and improved yield outcomes.

Given the increasing interest and investment in chiplet technology, the article by Das Sharma and colleagues serves as an essential read for professionals and enthusiasts alike who are keen on understanding the latest developments and challenges in this area. It provides valuable insights into the potential of SiP designs to revolutionize the semiconductor industry, making it a critical resource for anyone looking to stay at the cutting edge of semiconductor design and manufacturing.

VLOG

In the latest video, we delve into the transformative impact of AI-powered Electronic Design Automation (AI-EDA) on the semiconductor design industry. This revolutionary approach is not merely an upgrade but a complete reimagining of semiconductor design processes, integrating artificial intelligence to automate tasks, optimize designs, and enhance efficiency and accuracy. AI-EDA leverages machine learning to analyze complex data, predict outcomes, identify potential design flaws early, and customize solutions to specific project needs, significantly reducing design and manufacturing costs.

Despite its vast potential, the integration of AI into EDA presents challenges, including data protection and the technical complexities of merging AI with existing tools. Yet, the promise of AI-EDA is boundless, with future tools expected to provide bespoke solutions, foster collaboration among design teams, and push the boundaries of innovation.

GOVERNMENT

India gives green light to chip plants worth $15.2 billion. India, which is seeking to rival countries such as Taiwan in chipmaking, expects its semiconductor market to be worth $63 billion by 2026, but does not yet have a chipmaking facility. Tata will partner with Taiwan's Powerchip to set up India's first chipmaking plant worth 910 billion rupees in Gujarat state's Dholera, he said, while CG Power will partner with Japan's Renesas Electronics Corp and Thailand's Stars Microelectronics for a 76 billion rupees chip packaging plant, also in Gujarat. A third chip packaging plant worth 270 billion rupees will be set up in the eastern state of Assam by Tata unit Tata Semiconductor Assembly and Test Pvt Ltd,

One of Wales' leading tech facilities is being acquired in a £144m deal. Nexperia has agreed a deal to see its facility in Newport acquired by US tech giant Vishay Intertechnology. The American firm plans to invest £1bn into the 200m semiconductor wafer fab over the next three years to take advantage of demand for semiconductors in areas like electric vehicles as well as from the wider drive to net zero. It said a takeover will ensure its profitablity, while cementing its position as a vital clog in the emerging south Wales compound semiconductor cluster.

INDUSTRY

Pentagon Technologies will build $50M semiconductor equipment cleaning facility in Mesa. a critical materials supplier of advanced chamber cleaning equipment consumables to leading-edge semiconductor foundries, today announced that it is building a new cleaning facility in Mesa, Arizona. The facility is expected to be operational in Q4 2024.

Samsung Semiconductor India Research (SSIR) has opened its new R&D facility in Bengaluru, a significant milestone in SSIR's commitment to driving cutting-edge semiconductor research and development in. This is SSIR's second office in Bengaluru, with a capacity to accommodate close to 1600 professionals

ACADEMIA

India Boosts Semiconductor Workforce: Massive EDA Tool Access to 104 Universities. In a strategic move to fortify its semiconductor industry, India has facilitated unprecedented access to critical Electronic Design Automation (EDA) tools across 104 universities. This initiative, spearheaded by a union minister, underscores a significant leap towards nurturing a robust talent pool and accelerating research and development within the sector. By partnering with leading EDA suppliers - Cadence, Synopsys, and Siemens - the country aims to bridge the skill gap and foster innovation in semiconductor technology.

Siemens joins Semiconductor Education Alliance. Siemens Digital Industries Software announced today it has joined the Semiconductor Education Alliance to help build and nurture thriving communities of practice across the integrated circuit (IC) design and Electronic Design Automation (EDA) industries, from teachers and schools to universities, publishers, educational technology companies and research organizations. Founded by Arm in 2023 with a mission to help close education and skills gaps in the global semiconductor space, the Semiconductor Education Alliance brings together key stakeholders from across industry, academia, and government, to provide resources that help teachers, researchers, engineers and learners access new, accelerated educational pathways.

RESEARCH

Argonne National Lab gets $4M to develop MoS2 chips. The US Department of Energy (DOE) has awarded DOE’s Argonne National Laboratory $4million to fund research that will use atomic layer deposition (ALD) to advance 2D materials and devices for creating microchips that use up to 50 times less energy than current chips.

TOOLS

 Accel-Sim is a simulation framework for simulating and validating programmable accelerators like GPUs. 

Accel-Sim consists of four main components:

1. Accel-Sim Tracer: An NVBit tool for generating SASS traces from CUDA applications.

2. Accel-Sim SASS Frontend: A simulator frontend that consumes SASS traces and feeds them into a performance model. The intial release of Accel-Sim coincides with the release of GPGPU-Sim 4.0, which acts as the detailed performance model.

3. Accel-Sim Correlator: A tool that matches, plots and correlates statistics from the performance model with real hardware statistics generated by profiling tools.

4. Accel-Sim Tuner: An automated tuner that automates configuration file generation from a detailed microbenchmark suite.

Simulators like these are useful for the computer architecture research community, as it allows development of novel architectures of new workloads.

JOBS

Thousands of chip-manufacturing jobs are coming to metro Phoenix. Semiconductor companies and their suppliers are investing billions of dollars in new Arizona factories or fabs, but many of the people who eventually will be working at these sites haven’t entered the field yet. Many don't know how to enter or what opportunities are available. That’s why the tech industry is seeking to sign up and train apprentices who might ultimately fill the majority of full-time jobs. Taiwan Semiconductor Manufacturing Co., which is building a $40 billion complex in north Phoenix, is the first company in Arizona to join NIIT’s program, which began in 2022. NXP Semiconductors, with a facility in Chandler, also has expressed interest in joining.

The AI boom could create semiconductor jobs across the US and reduce reliance on risky Taiwan. Surging demand for the company's high-end chips — used to power AI technologies like ChatGPT — could help create jobs for chip designers, manufacturers, and suppliers across the semiconductor industry. It could also help bring more semiconductor chip manufacturing stateside and reduce the US's reliance on Taiwan — which remains vulnerable to Chinese invasion that would wreak havoc on the global economy. 

LET US CONNECT

Whether you are a student with the goal to enter semiconductor industry (or even academia) or a semiconductor professional or someone looking to learn more about the ins and outs of the semiconductor industry, please do reach out to me.

Let us together explore the world of semiconductor and the endless opportunities:

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