Semiconductor And Beyond Newsletter - #174

Semiconductor packaging is one of the last steps in semiconductor manufacturing and a crucial one. Protecting the silicon die from physical, mechanical, and thermal damage is only possible with a packaging solution. Silicon package technologies are also vital in developing interfaces that enable new architectures, like chiplet based XPUs.

THREAD

VLOG

RECENT BLOGS

Website
Facebook
Twitter
LinkedIn
Instagram
Threads
TikTok
YouTube
Google Scholar
RSS

Reply

or to participate.