- Chetan Arvind Patil
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- Semiconductor And Beyond Newsletter - #108
Semiconductor And Beyond Newsletter - #108

Advancements in package technology are as vital as advancements in technology nodes. These two semiconductor solutions enable silicon products to work per the required specifications. Technology node innovation has occurred more rapidly than package technology. Given that now the technology node is going to hit the node wall, it is time for package technology to provide avenues to shape the future of next-gen silicon design and manufacturing.
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